High purity copper tube target is a type of target material made from high-purity copper material through specific processing techniques, with specific dimensions and shapes. This type of target material is commonly used in the vacuum coating industry, especially in the sputtering process, for the preparation of thin films. High purity copper target materials are widely used in cutting-edge fields such as electronics, communication, superconductivity, aerospace, etc. due to their excellent physical and chemical properties. Specifically, for high-purity copper tube targets, they are tubular targets with high utilization efficiency, but are not easy to process and require a series of complex processing procedures to ultimately produce finished products. This type of target material has unique advantages in production, research and development, and technological applications, and has been widely used in industries such as information electronics, metallurgy, and new energy.
In addition, high-purity copper target materials typically have a purity of 4N (Cu ≥ 99.99%) or higher, making them a material used in thin film deposition processes with extremely high purity and specific physical and chemical properties. It is usually prepared in the shape of a flat plate or disk and used in physical evaporation, magnetron sputtering, and other processes to deposit copper material in atomic or molecular form on a substrate to prepare thin films or multilayer materials. The preparation and use of high-purity copper target materials require extreme quality control to ensure that the prepared thin films have high uniformity and purity. This highly pure copper target material has a wide range of applications in fields such as semiconductor manufacturing, display manufacturing, and photovoltaic cells.
