Multi arc target is a technique used for physical vapor deposition, which is based on arc discharge as an atomic source. During the multi arc coating process, strong local arc discharge is triggered by setting the potential difference between the target material and the substrate. These arcs can rapidly evaporate the material on the surface of the target material, producing high-energy ions and atoms. The high-energy plasma generated by the arc has extremely high chemical activity and kinetic energy, which makes the adhesion between the coating and the substrate stronger during the deposition process, and can deposit hard and dense thin films at lower substrate temperatures. This technology, due to its high-energy plasma properties, can produce denser and more adhesive coatings, which is particularly important in applications that require extreme wear and corrosion resistance. Multi arc coating equipment usually requires higher power stability and more precise arc control technology, and its deposition rate is usually much higher than traditional sputtering, making multi arc coating more suitable for industrial large-scale production.
Multi arc target material and sputtering target material are the two main types of sputtering coating technology. Sputtering coating is a physical vapor deposition process that ionizes argon gas to form plasma by applying high voltage. Charged argon ions are driven by an electric field to collide with the target material at high speed, causing the target material atoms or molecules to be physically impacted and escape from the surface, forming a thin film. Sputtering targets can be divided into planar targets, multi arc targets, and rotating targets according to their shape. Multi arc target materials and multi arc coating technology have demonstrated their unique advantages in application fields, especially in the electronics industry, such as semiconductor manufacturing, where copper targets are used to create conductive paths in integrated circuits through sputtering technology.
