Binding a silicon target is a process of soldering a silicon target material and a back target together, aimed at improving the efficiency of the target material and extending its lifespan. This process is mainly used in magnetron sputtering technology, which is a physical vapor deposition method used to deposit one or more thin films on a substrate material. The purpose of binding silicon targets is to prevent uneven fragmentation of the target material due to heat, save costs, and prevent deformation of the target material. In the binding process, commonly used methods include crimping, brazing, and conductive adhesive, among which brazing is the most commonly used method, and the brazing materials used include soft brazing materials such as In, Sn, In Sn, etc. This technology is not only suitable for flat targets such as circular, rectangular, or irregular silicon targets, but also for rotating targets. This is a cylindrical magnetron sputtering silicon target with different inner and outer diameters and length specifications, which is processed and manufactured according to the size and design requirements of large-scale coating equipment.
