一、 Core classification dimensions

1. According to chemical composition

Pure hafnium target material: Hf content ≥ 99.9%, containing trace amounts of Zr, nuclear reactor control rod coating, high-temperature alloy;

Hafnium alloy target material: adding Fe, Ti and other elements (such as Fe Hf alloy), wear-resistant tool coating, aerospace component protection;

Hafnium compound target materials: hafnium boride (HfB ₂), hafnium oxide (HfO ₂), etc., integrated circuit high dielectric gate, corrosion-resistant coating.

2. According to physical form

Flat target: standard rectangular/circular, compatible with mainstream sputtering equipment;

Customized irregular targets: Complex curved surface designs (such as tubes and rings) to meet special coating requirements.

二、 Key indicator description

Density: The density of the target material should be greater than 95% of the theoretical value (13.31g/cm ³) to avoid splashing holes in the film layer;

Grain size: ASTM grade 8 or above, ensuring uniform sputtering rate (tolerance ± 3%).

三、 Selection precautions

Semiconductor applications: It is necessary to use pure hafnium oxide (HfO ₂) targets with a purity of 4N or higher, as impurities can cause dielectric performance degradation;

Corrosion resistant coating: Fe Hf alloy target (Fe: 5-15%) is preferred, which improves acid and alkali resistance by 40%;

In the field of nuclear energy, it is necessary to control the zirconium content in hafnium to ≤ 1.5% to avoid abnormal neutron absorption cross-section.